Glass Substrate With Integrated Waveguides for Surface Mount Photonic Packaging

Co-packaged optics in next-generation datacenters require the assembly of multiple components on the same multichip module (MCM) and interconnection with hundreds of optical fibers. A novel photonic packaging substrate is required to leverage high-throughput electronic assembly with high precision optical alignment. This report highlights the results of glass substrate optimization to include optical waveguides, a fiber connector, and chip...