information about Flip chip field
Field Hierarchy
Parent | |||
---|---|---|---|
Substrate (printing) 0 papers | Chemistry 28.9M papers | Materials science 18.5M papers | Organic chemistry 12.9M papers |
Composite material 8.7M papers | Nanotechnology 4.1M papers | Layer (electronics) 1.4M papers | Adhesive 144k papers |
Current | |||
Flip chip 11.3k papers | |||
Child | |||
Thermal copper pillar bump 1,204 papers |
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History