Process (computing)

Engineering

Fabrication

Microelectromechanical systems

Materials science

Layer (electronics)

Etching (microfabrication)

Operating system

Surface micromachining

Computer science

Substrate (aquarium)

Geology

Oceanography

Biochemical engineering

Alternative medicine

Nanotechnology

Wafer

Process engineering

Environmental science

Medicine

Pathology

ICTACT Journal on Microelectronics

Wafer impurities and process particulates are one of the prime reason of MEMS device failure.Various cleaning methodologies are evolved but cleaning remains a critical process in MEMS domain as varied materials along with micromachining operations are involved.Bulk and surface micromachining process results in etching of substrate as well as various layers which necessitate evolving of proper cleaning methodology to avoid device failure.This article details the sources of contamination, role of contamination in MEMS domain, cleaning and measurement techniques to mitigate the effect on the device performance.

CONTAMINATIONS IN MEMS PROCESSES AND REMOVAL METHODOLOGY