Wafer

https://www.wikidata.org/wiki/Q267131

Field Hierarchy

Parent
Physics 33.7M papers	Engineering 25.7M papers	Materials science 19M papers	Electrical engineering 5M papers
Nanotechnology 4.3M papers		Optoelectronics 3.8M papers
Current
Wafer 129k papers
Child
Semiconductor device fabrication 9,019 papers	Wafer bonding 6,029 papers	Chip-scale package 5,400 papers	Wafer dicing 4,545 papers
Anodic bonding 4,121 papers	Through-silicon via 3,600 papers	Reticle 3,245 papers	Hybrid silicon laser 3,240 papers
Wafer-level packaging 2,972 papers		Wafer fabrication 2,963 papers

Trends

Notes

History