This website uses cookies.
We use cookies to improve your online experience. By continuing to use our website we assume you agree to the placement of these cookies.
To learn more, you can find in our Privacy Policy.
Original paper

Comprehensive Study on Advanced Chip on Wafer Hybrid Bonding with Copper/Polyimide Systems

Published: May 1, 2022
Abstract
We have studied the hybrid bonding process with a copper (Cu)/polyimide (PI) system by optimizing aqueous acid treatment, height control of Cu protrusion, and temporary/permanent bonding conditions for practical use. The study found that the treatment with an aqueous solution of citric or ascorbic acid and 80 nm-protrusion contributed to the improvement in the bonding yield of Cu electrodes. The suitable temperature and pressure of the permanent...
Paper Details
Title
Comprehensive Study on Advanced Chip on Wafer Hybrid Bonding with Copper/Polyimide Systems
Published Date
May 1, 2022
© 2025 Pluto Labs All rights reserved.
Step 1. Scroll down for details & analytics related to the paper.
Discover a range of citation analytics, paper references, a list of cited papers, and more.