Original paper
Comprehensive Study on Advanced Chip on Wafer Hybrid Bonding with Copper/Polyimide Systems
Published: May 1, 2022
Abstract
We have studied the hybrid bonding process with a copper (Cu)/polyimide (PI) system by optimizing aqueous acid treatment, height control of Cu protrusion, and temporary/permanent bonding conditions for practical use. The study found that the treatment with an aqueous solution of citric or ascorbic acid and 80 nm-protrusion contributed to the improvement in the bonding yield of Cu electrodes. The suitable temperature and pressure of the permanent...
Paper Details
Title
Comprehensive Study on Advanced Chip on Wafer Hybrid Bonding with Copper/Polyimide Systems
Published Date
May 1, 2022