In this study, a novel and Thermal-Gradient Creep (TGC) test aided with the Image Processing Method (IPM) was designed and performed on 63Sn-37Pb eutectic solder alloy. To obtain the creep data of ...
Abstract Creep is considered to be the life limiting damage mechanism in many load bearing high temperature components. A range of different parameters determine the creep life of a component, many of which are unlikely to be known to sufficient accuracy to enable satisfactory estimation of remnant life. Instead, the integrity of a component should be established through direct measurement of the response of the component to the operating conditions. Creep deformation is shown to be a positive f...
Spatially resolved measurement of creep deformation across weldments at high temperature cannot be achieved using standard extensometry approaches. In this investigation, a Digital Image Correlation (DIC) based system has been developed for long-term high-temperature creep strain measurement in order to characterise the material deformation behaviour of separate regions of a multi-pass weld. The optical system was sufficiently stable to allow a sequence of photographs to be taken suitable for DI...
Last. Jun-Ling Qu(NPU: Northwestern Polytechnical University)H-Index: 6
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Abstract SiC coating with a thickness of 50–70 µm was prepared on the surface of C/C composites by in-situ reaction method. The SiC coated C/C composites were then tested in a wind tunnel where a temperature gradient from 200 to 1600 °C could be obtained to investigate their erosion behavior. The results of wind tunnel test indicated that the service life of C/C composites was prolonged from 0.5 to 44 h after applying the SiC coating. After the wind tunnel test, three typical oxidation morpholog...
Last. Peter Cawley(Imperial College London)H-Index: 78
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Abstract This paper will demonstrate the use of a potential drop sensor to monitor strain. In particular, the suitability of the technique to high temperature or harsh environment applications presents an opportunity for monitoring strain in components operating under creep conditions. Monitoring creep damage in power station components is a long standing technological challenge to the non-destructive evaluation community. It is well established in the literature that strain rate serves as an ex...
Abstract The steady state creep in a rotating FGM disc having linearly varying thickness has been analyzed in the presence of linear thermal gradient. The disc is made of composite containing silicon carbide particles (SiCp) in a matrix of pure aluminium. The content of SiCp in the disc decreases non-linearly from the inner to the outer radius. The distributions of stresses and strain rates, resulting due to disc rotation, have been estimated by imposing various forms of linear thermal gradient ...
Last. Z.F. Yue(NPU: Northwestern Polytechnical University)H-Index: 16
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Abstract The crystallographic constitutive model under temperature gradient is developed and introduced to study the deformation and failure mechanisms of single crystal superalloy. Tensile tests of thin-walled pipe specimen at different temperatures without cooled air flow were carried out. Based on the experimental results, the temperature dependence of constitutive model was studied and the basic parameters of constitutive model were obtained. To investigate the deformation and failure mechan...
Last. Z.F. Yue(NPU: Northwestern Polytechnical University)H-Index: 16
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In the present study, a temperature gradient system was designed with the aim of carrying out the tensile and fatigue test of thin-walled cylindrical alloyed steel (30CrMnSi). The tensile test under different temperatures was first carried out to obtain the static mechanical parameters. And then a three-dimensional (3D) finite element model was constructed to further study the deformation behavior under temperature gradient by the finite element analysis (FEA). The FE result was in good agreemen...
Time-dependent deformations such as creep and ratchetting of solder alloys are significant deformation phenomena that need to be understood to ensure the safety and reliability of solder joints in electronic packaging. There is much research on creep deformation of solder alloys, but ratchetting deformation, especially the correlation between creep and ratchetting deformation of solder alloys has not been investigated. This paper discusses the correlation between creep and uniaxial ratchetting d...
#1L.O. Bueno(UFSCar: Federal University of São Carlos)H-Index: 5
#2Vitor Luiz Sordi(UFSCar: Federal University of São Carlos)H-Index: 13
Last. Luiz Marino(UFSCar: Federal University of São Carlos)H-Index: 3
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Creep results on 2.25Cr-1Mo were obtained at 600 °C, 650 °C and 700 °C at five stress levels, under constant load, in air and vacuum. Two chambers were specially developed for carrying out creep testing in controlled environment, with the possibility of accommodating inside them the load train, the extensometry system and the thermocouples. The creep machines used in this project present the advantage of allowing the performance of both constant load or constant stress creep testing, using inter...