A novel thermal-gradient creep test to evaluate the creep Behavior of Sn-Pb eutectic alloy

Published on Mar 16, 2021in Materials at High Temperatures1.389
· DOI :10.1080/09603409.2021.1894313
Niloufar Zarhanesh (Shahid Beheshti University), Mahmood Sameezadeh3
Estimated H-index: 3
(Shahid Beheshti University),
Majid Vaseghi7
Estimated H-index: 7
(Shahid Beheshti University)
Source
Abstract
In this study, a novel and Thermal-Gradient Creep (TGC) test aided with the Image Processing Method (IPM) was designed and performed on 63Sn-37Pb eutectic solder alloy. To obtain the creep data of ...
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