A novel thermal-gradient creep test to evaluate the creep Behavior of Sn-Pb eutectic alloy

In this study, a novel and Thermal-Gradient Creep (TGC) test aided with the Image Processing Method (IPM) was designed and performed on 63Sn-37Pb eutectic solder alloy. To obtain the creep data of the alloy and verify the novel creep test, three conventional isothermal tests at 68, 90, and 112 °C as well as the thermal-gradient test in the range of 68 to 112 °C were conducted using similar test conditions. In addition, the strain, strain rate,...