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Original paper

A novel thermal-gradient creep test to evaluate the creep Behavior of Sn-Pb eutectic alloy

Volume: 38, Issue: 3, Pages: 139 - 146
Published: Mar 16, 2021
Abstract
In this study, a novel and Thermal-Gradient Creep (TGC) test aided with the Image Processing Method (IPM) was designed and performed on 63Sn-37Pb eutectic solder alloy. To obtain the creep data of the alloy and verify the novel creep test, three conventional isothermal tests at 68, 90, and 112 °C as well as the thermal-gradient test in the range of 68 to 112 °C were conducted using similar test conditions. In addition, the strain, strain rate,...
Paper Details
Title
A novel thermal-gradient creep test to evaluate the creep Behavior of Sn-Pb eutectic alloy
Published Date
Mar 16, 2021
Volume
38
Issue
3
Pages
139 - 146
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