Enhancing thermal conductivity of epoxy with a binary filler system of h-BN platelets and Al2O3 nanoparticles

Epoxy resin is a common adhesive bonding material used to join dissimilar materials, especially in the electronics and aerospace industries. However, its low thermal conductivity and high coefficient of thermal expansion limit the direct use of epoxy in practical applications. In order to improve thermo-mechanical properties, we have prepared a series of epoxy composites using a binary system of hexagonal-boron nitride (h-BN) and aluminum oxide...