doi.org/10.1109/tcpmt.2019.2935477
Original paper

Electrical, Thermal, and Mechanical Characterization of eWLB, Fully Molded Fan-Out Package, and Fan-Out Chip Last Package

..., C.-P Hung
12
IEEE Transactions on Components Packaging and Manufacturing Technology3.00
Volume: 9, Issue: 9, Pages: 1765 - 1775
Published: Aug 22, 2019
Paper Fields
Paper Details
Title
Electrical, Thermal, and Mechanical Characterization of eWLB, Fully Molded Fan-Out Package, and Fan-Out Chip Last Package
DOI
doi.org/10.1109/tcpmt.2019.2935477
Published Date
Aug 22, 2019
Journal
IEEE Transactions on Components Packaging and Manufacturing Technology
Volume
9
Issue
9
Pages
1765 - 1775
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