Effects of film thickness and microstructures on residual stress

The accurate measurement of stress is an essential requirement of residual stress studying. In this paper, Cu thin films with different thickness were prepared by magnetron sputtering. The micromorphologies of the films were observed using atomic force microscopy, and the microstructures were analysed by transmission electron microscopy and X-ray diffraction. The residual stress distributions of the films were measured by the curvature and...