Study on the subsurface damage depth of monocrystalline silicon in ultrasonic vibration assisted diamond wire sawing

Diamond wire sawing is one of the key technologies in solar cell manufacturing process and semiconductor chip manufacturing process. The subsurface damage depth (SSD) affects the quality of machined surface in diamond wire sawing, which must be evaluated. In this paper, a mathematical model of the SSD in monocrystalline silicon wafers induced by ultrasonic vibration assisted diamond wire sawing (UAWS) was proposed. In this model, the input is...