Development and characterization of strong, heat-resistant and thermally conductive polyimide/nanodiamond nanocomposites

In this study, polymer nanocomposites based on polyimide (PI) and nanodiamond (ND) were prepared by in-situ polymerization. Polyamic acid (PAA), a precursor of PI, was polymerized in the presence of ND. ND was highly dispersed in PI at nanoscale. The excellent mechanical and thermal properties were achieved at very low content of ND. The Young's modulus increased approximately by 70% at ND content of 0.1 wt%. The strong enhancements in the...