The removal mechanism and force modelling of gallium oxide single crystal in single grit grinding and nanoscratching

Gallium oxide (Ga2O3) single crystals are an ultrawide bandgap semiconductor with wide industrial applications. Ultra-precision grinding is an essential shaping process in the fabrication of high quality Ga2O3 substrates. However, due to the lack of understanding of their removal mechanism, the development of high efficiency and low-damage grinding technology for Ga2O3 substrates faces great challenges. In this work, the removal mechanism of...