Electric field assisted solid‐state interfacial joining of TaC‐HfC ceramics without filler

The application of ultra‐high‐temperature ceramics (UHTCs) demands effective ways of joining in overcoming the problems associated with the fabrication of complex‐shaped components. In this study, we choose to investigate a new method of rapidly joining pre‐sintered TaC and HfC ceramics without any filler material using the spark plasma sintering (SPS) technique. A well‐bonded TaC–HfC interface was observed with no apparent cracking and porosity...