Study on mechanism of rotary in-feed surface grinding (Development of wireless thermometer)

In most cases, wafers are processed with rotary in-feed surface grinding (RISG). To understand material removal mechanism of RISG, it is important to measure temperature in contact zone of wheel and workpiece. However, using wired thermometer is not appropriate in this case for the reason that grinding wheel and wafer rotates around their own axes. In past research, we have developed wireless dynamometer, however its sampling rate was not high...