The search for the most conductive metal for narrow interconnect lines

A major challenge for the continued downscaling of integrated circuits is the resistivity increase of Cu interconnect lines with decreasing dimensions. Alternative metals have the potential to mitigate this resistivity bottleneck by either (a) facilitating specular electron interface scattering and negligible grain boundary reflection or (b) a low bulk mean free path that renders resistivity scaling negligible. Recent research suggests that...