Original paper
A novel liquid imidazole-copper (II) complex as a thermal latent curing agent for epoxy resins
Abstract
In this study, 1-cyanoethyl-2-ethyl-4-methylimidazole (1C2E4MI) was modified by copper chloride to improve its thermal latency towards epoxy resins. Unexpected complexation between 1C2E4MI and copper chloride was discovered, and two complexes which included a liquid and a solid were generated. The microanalytical results show that the ligand-metal ratios of these two complexes are 7:1 (liquid) and 1:1 (solid), rather than the theoretical 4:1...
Paper Details
Title
A novel liquid imidazole-copper (II) complex as a thermal latent curing agent for epoxy resins
Published Date
Sep 1, 2019
Journal
Volume
178
Pages
121586 - 121586
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Notes
History