Effects of low-temperature curing on physical behavior of cold-curing epoxy adhesives in bridge construction
Abstract
The effect of low-temperature curing on the physical characteristics of a commercial cold-curing epoxy adhesive was experimentally and analytically investigated with a view to a potential application in bridge construction in winter. Curing at low temperatures of 5–10 °C took place but the curing process was significantly decelerated due to material vitrification and the associated diffusion-controlled reaction. Existing dynamic and isothermal...
Paper Details
Title
Effects of low-temperature curing on physical behavior of cold-curing epoxy adhesives in bridge construction
Published Date
Jan 1, 2012
Volume
32
Pages
15 - 22
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