Review of metal matrix composites with high thermal conductivity for thermal management applications

Volume: 21, Issue: 3, Pages: 189 - 197
Published: Jun 1, 2011
Abstract
Metal matrix composites with high thermal conductivity and tailorable coefficient of thermal expansion are found widespread applications in electronic package and thermal management. The latest advances in manufacturing process, thermal properties and brazing technology of SiC/metal, carbon/metal and diamond/metal composites were presented. Key factors controlling the thermo-physical properties were discussed in detail. The problems involved in...
Paper Details
Title
Review of metal matrix composites with high thermal conductivity for thermal management applications
Published Date
Jun 1, 2011
Volume
21
Issue
3
Pages
189 - 197
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