Review paper

Novel organic–inorganic composites with high thermal conductivity for electronic packaging applications: A key issue review

Volume: 38, Issue: 4, Pages: 803 - 813
Published: Jun 22, 2015
Abstract
Significant progress has been made recently in developing the organic–inorganic composites with high thermal conductivity, low dielectric constant, and dielectric loss, for applications in the electronic packaging and substrates. Many studies have shown that some polymers filled with high thermal conductivity and low dielectric loss ceramics are suitable for electronic packaging for device encapsulation. Until now, extensive attentions have been...
Paper Details
Title
Novel organic–inorganic composites with high thermal conductivity for electronic packaging applications: A key issue review
Published Date
Jun 22, 2015
Volume
38
Issue
4
Pages
803 - 813
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