doi.org/10.1016/j.jmatprotec.2022.117686

Transient liquid phase bonding (TLPB) of Cu to Cu using Sn interconnect solder reinforced by submicron Al particles

..., Yi Zhang
59
Journal of Materials Processing Technology7.50
Volume: 307, Pages: 117686 - 117686
Published: Jun 22, 2022
Paper Fields
Paper Details
Title
Transient liquid phase bonding (TLPB) of Cu to Cu using Sn interconnect solder reinforced by submicron Al particles
DOI
doi.org/10.1016/j.jmatprotec.2022.117686
Published Date
Jun 22, 2022
Journal
Journal of Materials Processing Technology
Volume
307
Pages
117686 - 117686
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