The microstructure, melting properties and wettability of Sn–3.5Ag–0.7Cu–xIn lead-free solder alloys

In this work, Sn–3.5Ag–0.7Cu-xIn (SAC357-xIn) solder alloys were prepared using a high-frequency induction melting furnace and then treated under air cooling and water quenching, respectively. The evolution of the microstructure of the Sn–3.5Ag–0.7Cu–xIn lead-free solder alloys under the addition of indium and its effects on melting point, hardness and wettability were investigated. The results show that the addition of indium can remarkably...