Original paper
Integrated topology and packaging optimization using coupled material and component pseudo-densities
Volume: 64, Issue: 6, Pages: 3345 - 3380
Published: Oct 4, 2021
Abstract
This paper reviews a novel method for integrated topology and packaging optimization in lightweight systems design. Presented as the component-existence model, this approach introduces a new class of packaging design variable coupled with traditional material pseudo-densities in a standard topology workflow. This method adopts a modified interpolation scheme compatible with standard finite element mesh discretizations, and through development of...
Paper Details
Title
Integrated topology and packaging optimization using coupled material and component pseudo-densities
Published Date
Oct 4, 2021
Volume
64
Issue
6
Pages
3345 - 3380
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