Original paper

Engineering Tough Metallosupramolecular Hydrogel Films with Kirigami Structures for Compliant Soft Electronics

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Volume: 17, Issue: 41
Published: Sep 12, 2021
Paper Details
Title
Engineering Tough Metallosupramolecular Hydrogel Films with Kirigami Structures for Compliant Soft Electronics
Published Date
Sep 12, 2021
Journal
Volume
17
Issue
41
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