Anisotropic constitutive model coupled with damage for Sn-rich solder: Application to SnAgCuSb solder under tensile conditions

With the rapid development of microelectronics and nanoelectronics, Moore law has significantly slowed down and More than Moore based system in packaging (SiP) is expected to be more and more important, at least for next one to two decades. Mechanical behaviors of interconnect materials such as solders are critical for yield in processes and reliability in testing and operation. Based on the framework of crystal plastic theory and continuum...