Modified solution of an interface rigid line between two bonded half-planes under remote in-plane heat flux

Volume: 232, Issue: 10, Pages: 4189 - 4198
Published: Aug 14, 2021
Abstract
A modified closed-form solution is presented for the problem of a finite interface rigid line between two bonded half-planes under remote in-plane heat flux in the context of linear plane thermoelasticity. Different from the existing analytical solutions in the literature, the influence of the expansion of the rigid line caused by thermal load is incorporated in the modified solution. We reduce the corresponding boundary value problem to the...
Paper Details
Title
Modified solution of an interface rigid line between two bonded half-planes under remote in-plane heat flux
Published Date
Aug 14, 2021
Volume
232
Issue
10
Pages
4189 - 4198
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