Highly Thermal Stable Polyimides Applied in Flexible Resistive Memory

Volume: 306, Issue: 12
Published: Aug 25, 2021
Abstract
Flexible memory devices are one of the most crucial elements in the wearable electronics. In this work, polyimides (PIs)‐based flexible resistive memory devices with an excellent thermal and mechanical durability are demonstrated. Four kinds of functional PIs are derived from the heterocyclic diamines including 2,6‐diaminodibenzo‐ p ‐dioxin (OODA) and 2,6‐diaminothianthrene, and dianhydrides including 4,4′‐(hexafluoroisopropylidene)diphthalic...
Paper Details
Title
Highly Thermal Stable Polyimides Applied in Flexible Resistive Memory
Published Date
Aug 25, 2021
Volume
306
Issue
12
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