Thematic issue of mechanics of materials-fracture, damage and adhesion in soft materials

Effective acquisition of the related mechanical properties of lead-free solder alloys through micro-indentation tests is of great significance in the research on electronic interconnection design and reliability for the multi-functionalization and high integration of electronic products. The temperature-dependent elastoplastic and creep parameters of Sn–3.0Ag–0.5Cu (SAC) solder are systematically investigated by micro-indentation with plural...