Engineering

Wafer-level packaging

Telecommunications

Computer science

Antenna (radio)

Wideband

Wafer

Electronic engineering

Wireless

Dipole antenna

Electrical engineering

IEEE Transactions on Antennas and Propagation

A novel fan-out wafer-level packaging (FOWLP) technology with double-sided redistribution layers (RDLs) and tall copper vertical interconnects is described. The design of a dual-polarized magnetoelectric (ME) dipole antenna based on this new packaging technology is presented. It is shown that the antenna with a size of <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$10\times10$ </tex-math></inline-formula> mm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> achieves good impedance matching and a stable radiation pattern over a wide bandwidth from 25 to 43 GHz, which can cover most of the millimeter-wave (mmWave) bands of the fifth-generation (5G) mobile networks in different countries. The measurement results demonstrate that the antenna is well suited for FOWLP technology and can be used for phased-array modules in 5G wireless communication systems.

A Wideband mmWave Antenna in Fan-Out Wafer Level Packaging With Tall Vertical Interconnects for 5G Wireless Communication