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doi.org/10.1016/j.matchemphys.2021.124589
Other

Boiling heat transfer properties of copper surface with different microstructures

..., Jinkai Xu
24
Materials Chemistry and Physics4.30
Volume: 267, Pages: 124589 - 124589
Published: Apr 9, 2021
Abstract
No abstract.
Paper Fields
Paper Details
Title
Boiling heat transfer properties of copper surface with different microstructures
DOI
doi.org/10.1016/j.matchemphys.2021.124589
Published Date
Apr 9, 2021
Journal
Materials Chemistry and Physics
Volume
267
Pages
124589 - 124589
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