Boiling heat transfer properties of copper surface with different microstructures

Volume: 267, Pages: 124589 - 124589
Published: Jul 1, 2021
Abstract
The T-shaped groove surface with groove width of 0.3–1.2 mm and groove depth of 0.6–1.5 mm is prepared on the copper surface by using electric spark wire cutting technology, Set up a set of wall temperature measurement, bubble visualization and steady flow heating test bench. Experimental observations of boiling heat transfer of deionized water on different heat transfer surfaces are achieved. The boiling curves of T-shaped surface such as...
Paper Details
Title
Boiling heat transfer properties of copper surface with different microstructures
Published Date
Jul 1, 2021
Volume
267
Pages
124589 - 124589
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