Thermal analysis of electronic packaging structure using isogeometric boundary element method

The purpose of this paper is to carry out heat transfer analysis of integrated circuit (IC) packaging structures by the isogemoetric boundary element method (IGABEM). In service time, chips of electronic packaging structure produce lots of heat, which leads to resultant equations including domain integrals. In this work, the radial integration method is used to deal with domain integrals caused by the heat source. Since material properties of...