Original paper
High‐thermal‐conduction and low‐cost composite originated from the tight packing structure of boron nitride sheets and binary alumina balls
Abstract
In this work, a novel low‐cost and thermal conductive composite consisting of boron nitride (BN)/aluminum oxide (Al 2 O 3 ) heat transfer network was constructed by the high packing volume fraction of two sizes Al 2 O 3 spheres at the optimal weight ratio. The dense packing of 5 μm Al 2 O 3 and 20 μm Al 2 O 3 supports the BN sheets scattering around Al 2 O 3 to interconnect into main three‐dimensional BN network, and acts as thermal conductive...
Paper Details
Title
High‐thermal‐conduction and low‐cost composite originated from the tight packing structure of boron nitride sheets and binary alumina balls
Published Date
Apr 21, 2021
Journal
Volume
42
Issue
7
Pages
3562 - 3571
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Notes
History