A lightweight and high thermal performance graphene heat pipe

Published on Feb 1, 2021
· DOI :10.1002/NANO.202000195
Ya Liu4
Estimated H-index: 4
(Fudan University),
Shujing Chen4
Estimated H-index: 4
(SHU: Shanghai University)
+ 5 AuthorsJohan Liu54
Estimated H-index: 54
(Chalmers University of Technology)
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As transistors continue to decrease in size and packing densities increase, thermal management becomes a critical bottleneck for development of the next generation of compact and flexible electronics. The increase in computer usage and ever-growing dependence on cloud systems require better methods for dissipating heat away from electronic components. The important ingredients of thermal management are the thermal interface materials. The discovery of excellent heat conduction properties of grap...
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Development of the next generation thermal interface materials with high thermal conductivity is important for thermal management and packaging of electronic devices. We report on the synthesis and thermal conductivity measurements of non-curing thermal paste, i.e. grease, based on mineral oil with the mixture of graphene and few-layer graphene flakes as the fillers. It was found that graphene thermal paste exhibits a distinctive thermal percolation threshold with the thermal conductivity reveal...
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Elaborate manipulation of heat transfer renders proper operation of diverse thermal-related technologies. However, accurate implementation of thermal-based or transduction sensing on a thin flexible film over unusual surfaces remains challenging. Herein efficient thermal management realizes highly accurate flexible multifunctional sensor sheets using a low thermal conductive medium as a thermal barrier. An approximately 50-fold enhancement in the thermal sensing accuracy, which is nearly indepen...
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It has been reported that the introduction of reduced graphene oxide (RGO) can enhance the crystallization and orientation of high-density polyethylene (HDPE) matrix and thus improve the mechanical...
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The development of high-performance thermal management materials to dissipate excessive heat both in plane and through plane is of special interest to maintain efficient operation and prolong the life of electronic devices. Herein, we designed and constructed a graphene-based composite film, which contains chiral liquid crystals (cellulose nanocrystals, CNCs) inside graphene oxide (GO). The composite film was prepared by annealing and compacting of self-assembled GO-CNC, which contains chiral sm...
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Graphene is considered as a promising candidate material to replace silicon for the next-generation nanoelectronics because of its superb carrier mobility. To evaluate its thermal dissipation capability as electronic materials, the thermal transport in monolayer graphene was extensively explored over the past decade. However, the supported chemical vapor deposition (CVD) grown monolayer graphene with submicron structures were seldom studied, which is important for practical nanoelectronics. Here...
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Electrical devices generate heat at work. The heat should be transferred away immediately by a thermal manager to keep proper functions, especially for high-frequency apparatuses. Besides high thermal conductivity (K), the thermal manager material requires good foldability for the next generation flexible electronics. Unfortunately, metals have satisfactory ductility but inferior K (≤429 W m−1 K−1), and highly thermal-conductive nonmetallic materials are generally brittle. Therefore, fabricating...
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Graphene-based film attracts tremendous interest in many potential applications due to its excellent thermal, electrical, and mechanical properties. This review focused on a critical analysis of fabrication, processing methodology, the interfacial modification approach, and the applications of this novel and new class material. Strong attention was paid to the preparation strategy and interfacial modification approach to improve its mechanical and thermal properties. The overview also discussed ...
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