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doi.org/10.1016/j.coco.2020.03.011
Recent advances in polymer-based electronic packaging materials
Yan‐Jun Wan
23
,
Gang Li
77
,
...,
Rong Sun
8
View all 6 authors
Composites Communications
7.70
Volume: 19, Pages: 154 - 167
Published
: Mar 21, 2020
158
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Paper Fields
Electrical engineering
Nanotechnology
Thermal grease
Electronic packaging
Flip chip
Engineering
Electronics
Composite material
Materials science
Filler (materials)
Layer (electronics)
Adhesive
Thermal conductivity
Electronic materials
Polymer
Paper Details
Title
Recent advances in polymer-based electronic packaging materials
DOI
doi.org/10.1016/j.coco.2020.03.011
Published Date
Mar 21, 2020
Journal
Composites Communications
Volume
19
Pages
154 - 167
Notes
History
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