Process (computing)

Engineering

Materials science

Embedded system

Layer (electronics)

Through-silicon via

Etching (microfabrication)

Systems engineering

Operating system

Computer science

Silicon

Nanotechnology

Computer architecture

Integrated circuit

Integrated circuit packaging

Characterization (materials science)

Interposer

Optoelectronics

We report the first successful technology integration of chiplets on an active silicon interposer, fully processed, packaged and tested. Benefits of chiplet-based architectures are discussed. Built up technology is presented and focused on 3D interconnects process and characterization. 3D packaging is presented up to the successful structural test and characterization of the demonstrator.

Active Interposer Technology for Chiplet-Based Advanced 3D System Architectures