doi.org/10.1016/j.compositesa.2018.12.019

High-performance epoxy/binary spherical alumina composite as underfill material for electronic packaging

..., Yiu‐Wing Mai
108
Composites Part A Applied Science and Manufacturing8.90
Volume: 118, Pages: 67 - 74
Published: Dec 22, 2018
Paper Fields
Paper Details
Title
High-performance epoxy/binary spherical alumina composite as underfill material for electronic packaging
DOI
doi.org/10.1016/j.compositesa.2018.12.019
Published Date
Dec 22, 2018
Journal
Composites Part A Applied Science and Manufacturing
Volume
118
Pages
67 - 74
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