Novel dielectric BN/epoxy nanocomposites with enhanced heat dissipation performance for electronic packaging

Two-dimensional hexagonal boron nitride (h-BN) has excellent and useful mechanical and thermal properties, and can be used as a novel filler to enhance the thermal conductivity of polymer composites. We prepared exfoliated h-BN nanoplatelets (BNNP) with hydroxyl functional groups using a hydroxide-assisted ball milling process, and demonstrated the enhanced thermal conductivity of its epoxy nanocomposites. The prepared BNNP are highly soluble...