Microstructure evolution mechanism during post-bond heat treatment of transient liquid phase bonded wrought IN718 superalloy: An approach to fabricate boride-free joints

The microstructure of a transient liquid phase (TLP) bonded nickel base superalloy using B-containing filler metal after completion of isothermal solidification can usually be described by a eutectic-free joint centerline with extensive in-situ boride precipitation in the diffusion affected zone which in turn can affect the joint properties. Therefore, designing a proper post-bond heat treatment is needed to produce a robust joint. This paper...