Original paper
Development of physical and mechanical properties of a cold-curing structural adhesive in a wet bridge environment
Abstract
The physical and mechanical properties of a cold-curing structural epoxy adhesive, exposed to a wet bridge environment, were investigated. A significant decrease of the glass transition temperature, tensile E-modulus and tensile strength was observed which could be attributed to plasticization. The retention of 70% of the E-modulus and strength at an average 10 °C reference temperature was predicted using the Arrhenius law after a 100-year...
Paper Details
Title
Development of physical and mechanical properties of a cold-curing structural adhesive in a wet bridge environment
Published Date
Jul 1, 2017
Volume
144
Pages
115 - 124
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Notes
History