Fracture analysis of an edge-cracked dielectric plate via novel boundary integral equation method

Dielectric materials are widely used as insulating materials in electronic devices. However, cracks inside dielectric materials may cause performance degradation of the electronic devices. In this paper, the sub-region boundary element method is developed for handling the edge crack problem, in which the area in the crack cavity is treated separately. The proposed method is distinguished from any existing boundary element formulation for...