Long-term development of thermophysical and mechanical properties of cold-curing structural adhesives due to post-curing

Volume: 127, Issue: 4, Pages: 2490 - 2496
Published: May 14, 2012
Abstract
The long‐term changes in the thermophysical and mechanical properties of a cold‐curing structural epoxy adhesive were investigated by accelerating the curing reaction by post‐curing at elevated temperatures. Experimental data concerning the glass transition temperature for periods of up to 7 years and tensile strength and stiffness measurements could be extrapolated for a period of up to 17 years. An existing model for the long‐term development...
Paper Details
Title
Long-term development of thermophysical and mechanical properties of cold-curing structural adhesives due to post-curing
Published Date
May 14, 2012
Volume
127
Issue
4
Pages
2490 - 2496
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