Heat transfer coefficient

Engineering

Oxide

Nanoparticle

Critical heat flux

Heat transfer

Metallurgy

Materials science

Heat flux

Chemical engineering

Copper oxide

Boiling heat transfer

Mass transfer

Nucleate boiling

Surface roughness

Physical chemistry

Thermodynamics

Physics

Nanotechnology

Mass transfer coefficient

Aqueous solution

Boiling

Composite material

Nanofluid

Chemistry

Copper

International Journal of Thermal Sciences

A set of experiments have been performed to quantify the pool boiling heat transfer coefficient of dilute copper oxide water-based nanofluids at mass concentrations of 0.1–0.4%. To stabilize the two-step nanofluids, pH control, stirring and sonication were utilized. For investigating the influence of surfactant as a surface active agent additive on the pool boiling heat transfer coefficient of nanofluids, SDS, SDBS and Triton X-100 were used. Influence of some operating parameters such as applied heat flux, mass concentration of nanofluids and other parameters such as roughness of surface, boiling contact angle and deposition on the pool boiling heat transfer coefficient of nanofluids were experimentally investigated. Results demonstrated a significant deterioration of heat transfer coefficient of nanofluids comparing with the base fluid in the absence of surfactants, however, in the presence of surfactant, higher pool boiling heat transfer coefficient was reported. According to results, roughness of surface is strongly controlled by nanofluid concentration due to deposition of nanofluids on the heating section. Rectilinear changes of deposition with time in term of fouling resistance were seen at both regions with natural convection and nucleate boiling dominant heat transfer mechanisms.

Pool boiling heat transfer to dilute copper oxide aqueous nanofluids