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doi.org/10.1038/ncomms4525
Original paper
Resonant bonding leads to low lattice thermal conductivity
Sangyeop Lee
,
Keivan Esfarjani
46
,
Gangjie Chen
Nature Communications
Published
: Apr 28, 2014
611
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Paper Fields
thermoelectric performance
thermoelectric properties
department physics
lattice thermal
seebeck coefficient
expansion coefficient
thermoelectric power
Paper Details
Title
Resonant bonding leads to low lattice thermal conductivity
DOI
doi.org/10.1038/ncomms4525
Published Date
Apr 28, 2014
Journal
Nature Communications
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History
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