Tin whiskers studied by synchrotron radiation scanning X-ray micro-diffraction

A large number of Sn whiskers have been found on the Pb-free solder finish on leadframes used in consumer electronic products. Some of the whiskers on eutectic SnCu finishes are long enough to short the neighboring legs of the leadframe. Tin whisker growth is known to be a stress relief phenomenon. We have performed synchrotron radiation X-ray micro-diffraction analysis to measure the local stress level, the orientation of the grains in the...