Original paper
Crack growth calculations in solder joints based on microstructural phenomena with X-FEM
Abstract
Determining the lifetime of solder joints subjected to thermomechanical loads is crucial to guarantee the quality of electronic devices. The fatigue process is heavily dependent on the microstructure of the joints. We present a new methodology to determine the lifetime of the joints based on microstructural phenomena. Random microstructures are generated to capture the statistical variety of possible microstructures and crack growth calculations...
Paper Details
Title
Crack growth calculations in solder joints based on microstructural phenomena with X-FEM
Published Date
Jan 1, 2011
Volume
50
Issue
3
Pages
1145 - 1156
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