Thermomechanical behaviors and dielectric properties of polyaniline-doped para-toluene sulfonic acid/epoxy resin composites

Published on Aug 1, 2012in Polymers for Advanced Technologies2.578
· DOI :10.1002/PAT.2029
Belkacem Belaabed10
Estimated H-index: 10
Jean-Luc Wojkiewicz16
Estimated H-index: 16
(university of lille)
+ 2 AuthorsNathalie Redon11
Estimated H-index: 11
(university of lille)
Composites based on conductive organic/inorganic fillers dispersed in insulating matrix have been widely investigated because of their widespread applications such as electromagnetic shielding, electrostatic discharge, and sensors. In this context, novel composite materials based on epoxy resin matrix charged with polyaniline (PANI)-doped para-toluene sulfonic acid were elaborated. Fourier transform infrared spectroscopy, X-ray diffraction and scanning electron microscopy were used to check the structure and the morphology of the samples. Viscoelastic behavior and thermal stability of the composites were explored by dynamic mechanical thermal analysis and thermogravimetric analysis. It was shown that the PANI particles exhibited a partial crystalline structure and were homogeneously dispersed in epoxy matrix. Consequently, this structure affected the thermal stability and viscoelastic properties of the composites. Furthermore, the dielectric and electrical properties were investigated up to 1 MHz. Measurements of dielectric properties revealed that with loading fillers in matrix, the dielectric parameters increased to high values at low frequency then decreased at values around 40 and 32 of real and imaginary parts, respectively, at 1 MHz with 15% of PANI content. Copyright © 2011 John Wiley & Sons, Ltd.
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