Quantum mechanics

Adhesion

Composite number

Engineering

Oxide

Metallurgy

Materials science

Layer (electronics)

Thermal conductivity

Thermal resistance

Chemical engineering

Physics

Thermal grease

Nanotechnology

Thermal

Miniaturization

Isotropy

Composite material

Contact resistance

Meteorology

Thermal conduction

Thermal stability

Thermal contact

Electrical conductor

Materials Horizons

The dramatic miniaturization and integration of electronic devices call for next-generation thermally conductive interface materials with higher service performance and long-term stability. In addition to enhancing the inherent thermal conductivity of materials, it is noteworthy to pay attention to the thermal contact resistance. Herein, we synthesized a polyurethane with hierarchical hydrogen bonding to realize high surface adhesion with substrates; another key was incorporating aluminum oxide modified by a deformable liquid metal to improve the thermo-conductive capability and offer the freedom of polymeric segmental motions. These molecular and structural designs endow the composite with high isotropic thermal conductivity, electrical insulation and temperature-responsive reversible adhesion, which enable low thermal resistance and durable thermal contact with substrates without the need for external pressure.

A thermally conductive interface material with tremendous and reversible surface adhesion promises durable cross-interface heat conduction