Power–delay product

Adder

Engineering

Materials science

Computer science

Ternary operation

Electronic engineering

Crosstalk

Programming language

CMOS

Optoelectronics

ECS Journal of Solid State Science and Technology

The investigation of crosstalk issues for coupled through silicon vias (TSVs) in ternary logic is presented in this study. The crosstalk issues are analyzed for coupled TSVs utilizing multi-walled carbon nanotube (MWCNT) as conductive filler, and polymer liners such as polyimide, polypropylene carbonate (PPC), benzocyclobutene (BCB) as insulating materials. For the coupled TSVs, the electrical equivalent circuit model is used to investigate the crosstalk which is driven by the ternary inverter. Based on the Hewlett simulation program with integrated circuit emphasis (HSPICE) simulations, the effects of crosstalk such as functional and dynamic crosstalk for proposed TSVs are compared with single-walled CNT (SWCNT) TSVs. Furthermore, the other performance parameters such as power dissipation, power delay product (PDP), and energy delay product (EDP) are investigated. The crosstalk effects of the proposed model are also examined for various TSV heights. It is noticed that the BCB based coupled MWCNT TSVs provide a significant improvement in crosstalk at reduced TSV height. It is also noticed that the proposed TSVs improved the overall performance up to 30.21% compared to the SWCNT based TSVs. Hence, the MWCNT based TSVs with BCB liner are most suitable for ternary logic integrated circuits (ICs) over the conventional TSVs.

Investigation of Crosstalk Issues for MWCNT Bundled TSVs in Ternary Logic