structural optimization

structural topology optimization

thermal performance

parameter optimization

thermal resistance

transfer bibliography

microchannel heat

power mosfets

heat sinks

Numerical Heat Transfer Part B-fundamentals

Microchannel is helpful for cooling the microelectronic devices with high heat flux. In this study, topology optimization method with three objective functions (pumping power, bottom wall mean temperature and temperature uniformity) is adopted to optimize the structure of a manifold microchannel. The field synergy principle is used to evaluate the optimized structures. Several single-objective, bi-objective, and triple-objective function problems are numerically studied. It is found that the obtained structures with better cooling performance always present low synergy angle, in consistent with the field synergy principle. The optimized structures perform better than conventional microchannel with ribs. Effects of inlet velocity, thermal diffusivity ratio and heat flux at the bottom wall are also investigated. The topology optimization method with triple-objective functions is effective to improve the performance of manifold microchannels.

Topology optimization of the manifold microchannels with triple-objective functions