Microstructure and Tensile Strength of the Bonded Interfaces and Parent Materials in W/ODS Steel Joints Fabricated by Direct SSDB

Volume: 52, Issue: 8, Pages: 3647 - 3660
Published: Jun 2, 2021
Abstract
In the present work, Tungsten (W)/oxide dispersion strengthened (ODS) steel joints were fabricated by the direct solid state diffusion bonding (SSDB) technology with a multistage cooling process, and the microstructure and tensile strength of the bonded interfaces and parent materials were experimentally investigated. The results show that W and ODS steel can be successfully bonded at the temperature ranging from 900 °C to 1050 °C, without...
Paper Details
Title
Microstructure and Tensile Strength of the Bonded Interfaces and Parent Materials in W/ODS Steel Joints Fabricated by Direct SSDB
Published Date
Jun 2, 2021
Volume
52
Issue
8
Pages
3647 - 3660
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