Thermal and hydraulic performance analysis of a heat sink with corrugated channels and nanofluids

Cooling of electronic devices is one of the critical challenges that the electronics industry is facing towards sustainable development. Aiming at lowering the surface temperature of the heat sink to limit thermally induced deformations, corrugated channels and nanofluids are employed to improve the thermal and hydraulic performances of a heat sink. Three-dimensional simulations based on the finite-volume approach are carried out to study...